im very glad to review this nice kit from the world famous memory manufacturer Team Group Inc.
The mems just arrived today, looks very solid so decided to take a few pics and share it before the results.
The heatsink is very massive, has no screws no holes, its fixed with the usual gluetape to the ic's. I guess its not a big surprise that the sticks are single sided. You can find the specs a bit loose, but trust me on the black PCB there are sitting high binned samsung B-die ic's. So i expect very nice results, will see in the next few days. Stay tuned...
![Image](http://i.imgur.com/uiJ5yz0.jpg)
P/N: TXD416G3600HC18ADC01
Capacity: 8GBx2
Color: Black
Description: TEAM XTREEM DDR4 3600 CL18-20-20-39 1.35V
More info:
http://www.teamgroupinc.com/en/product/ ... DR4%203600
http://www.teamgroupinc.com/Uploads/pro ... u93tGP.pdf
![Image](http://i.imgur.com/Npzhl9f.jpg)
![Image](http://i.imgur.com/Siq8KYa.jpg)
![Image](http://i.imgur.com/FImaSW0.jpg)
![Image](http://i.imgur.com/6sbJQ4a.jpg)
![Image](http://i.imgur.com/M9nawES.jpg)
special thanks to my brother Kevin, you know what i mean...